ISSN 0253-2778

CN 34-1054/N

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Numerical simulation of heat transfer performance of CFRP plate adhesive structure

  • 1.

    Department of Thermal Science and Energy Engineering,University of Science and Technology of China, Hefei 230027, China

  • 2.

    Shanghai YS Information Technology Co.,Ltd.,Shanghai200240, China

Cite this: JUSTC, 2019, 49(6): 487-493
https://doi.org/10.3969/j.issn.0253-2778.2019.06.008
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  • Received Date: November 27, 2018
  • Revised Date: February 19, 2019
  • Published Date: June 29, 2019
    Abstract
  • The steady-state heat transfer characteristics of typical bonding structures such as butting and splicing in carbon fiber reinforced composite (CFRP) grille reflector were analyzed by ANSYS finite element method. The effects of epoxy resin with high thermal conductivity materials such as alumina, silicon nitride and graphene on heat transfer were compared and analyzed. The results show that with the increase in thermal conductivity of epoxy resin adhesives, the thermal resistance of the bonding interface decreases, the temperature difference of bonding site decreases, and the temperature distribution uniformity is higher, thus providing a research basis for effectively predicting the temperature distribution and thermal deformation of solid reflectors in orbit.
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