Abstract
The mini-channel structured radiator filled with copper porous media was proposed for heat transfer enhancement. The performance of this radiator was studied in terms of heat flux, Nusselt number and thermal resistance through several measurements of the mass flux, temperature difference and pressure drop between inlet and outlet of the coolant. It is found that the mean volume heat flux of this radiator reaches up to 250 W/mm3. Compared with the Rj, in-Δp relationship of Zhangs results, it is found that lower consumption of pump and thermal resistance can be achieved. Additionally, numerical simulation indicates that the radiator with copper porous media may obtain more uniform temperature distribution.
Abstract
The mini-channel structured radiator filled with copper porous media was proposed for heat transfer enhancement. The performance of this radiator was studied in terms of heat flux, Nusselt number and thermal resistance through several measurements of the mass flux, temperature difference and pressure drop between inlet and outlet of the coolant. It is found that the mean volume heat flux of this radiator reaches up to 250 W/mm3. Compared with the Rj, in-Δp relationship of Zhangs results, it is found that lower consumption of pump and thermal resistance can be achieved. Additionally, numerical simulation indicates that the radiator with copper porous media may obtain more uniform temperature distribution.