Abstract
The adhesive structure of carbon fiber reinforced plastics (CFRP) is an important part of the high precision solid surface reflector, the thermal load is the main load of the reflector in orbit, and the interface thermal resistance has an important influence on the temperature distribution of high precision solid surface reflector in orbit. According to the principle of interface thermal resistance measurement, an experimental device was designed to accurately measure the thermal conductivity of CFRP monolithic structure and the interface thermal resistance of cementation structure at different temperatures. The accuracy of the experimental device was verified by comparing the measured thermal conductivity of 304 stainless steel with the standard values. To improve the thermal conductivity of epoxy resin, three single additives were introduced: silicon nitride (β-Si3N4), alumina (Al2O3), and graphene. The experimental results show that as the volume fraction of additives increases, the thermal conductivity also increases, thus enhancing the heat transfer at the bonding sites and reducing the interface thermal resistance. Under the same conditions, the interface thermal resistance of the adhesive decreases with the increase of temperature.
Abstract
The adhesive structure of carbon fiber reinforced plastics (CFRP) is an important part of the high precision solid surface reflector, the thermal load is the main load of the reflector in orbit, and the interface thermal resistance has an important influence on the temperature distribution of high precision solid surface reflector in orbit. According to the principle of interface thermal resistance measurement, an experimental device was designed to accurately measure the thermal conductivity of CFRP monolithic structure and the interface thermal resistance of cementation structure at different temperatures. The accuracy of the experimental device was verified by comparing the measured thermal conductivity of 304 stainless steel with the standard values. To improve the thermal conductivity of epoxy resin, three single additives were introduced: silicon nitride (β-Si3N4), alumina (Al2O3), and graphene. The experimental results show that as the volume fraction of additives increases, the thermal conductivity also increases, thus enhancing the heat transfer at the bonding sites and reducing the interface thermal resistance. Under the same conditions, the interface thermal resistance of the adhesive decreases with the increase of temperature.
Open Access
JUSTC
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