Abstract: Experimental and numerical investigation on the thermal performances of mini-channel heat sinks for cooling the integrated electronic chip with 50 W/cm2 power density using the liquid-cooling technology was conducted. The characteristics of total heat exchange and heat flux performance were obtained by measuring and simulating the heated surface temperature, the inlet and outlet temperature of coolant, under different flow rates and heating power conditions. The heat sinks can effectively remove the high density heat generated by the integrated electronic chip on the surface heat flux up to 56 W/cm2 and the pressure drop under 400 Pa with Reynolds number under 50 and surface temperature under 85 ℃. The friction factor of mini-channel heat sinks decreases with Reynolds number under the Reynolds number we checked and the heat flux increases with the surface temperature and flow rate. The convective heat transfer coefficient of the mini-channel heat sinks increases with Reynolds number, and the extent increases with power density.